What is the difference between a discrete component and integrated circuit?

What is the difference between a discrete component and integrated circuit?

Any system can be constructed by using discrete components and also by an IC. We cannot physically put all multiple discrete circuits on a plate of silicon and simply call it an integrated circuit. Integrated circuits are made up of silicon wafers, not inserted (or placed) onto silicon wafers.

Why are discrete components used?

Discrete components are widely used in amplifiers and other electronic products that use large amounts of current. On a circuit board, they are intermingled with the chips, and there is hardly any electronic product that does not have at least one or two discrete resistors or capacitors.

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What is IC and its importance?

An integrated circuit, or IC, is small chip that can function as an amplifier, oscillator, timer, microprocessor, or even computer memory. These extremely small electronics can perform calculations and store data using either digital or analog technology.

What are the advantages of ICs over discrete circuits?

The weight of an IC is very less as compared entire discrete circuits. It’s more reliable. Because of their smaller size it has lower power consumption. It can easily replace but it can hardly repair, in case of failure. Because of an absence of parasitic and capacitance effect it has increased operating speed.

What are the limitations of ICS?

Limited power rating as it is not possible to manufacture high power (say greater than 10 W) ICs. Need of connecting inductors and transformers exterior to the semiconductor chip as it is not possible to fabricate inductor and transformers on the semiconductor chip surface.

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What are the advantages of integrated circuits?

Greater ability of operating at extreme temperatures. Suitable for small signal operation because of no chance of stray electrical pickup as various components of an INC are located very close to each other on a silicon wafer. No component project above the chip surface in an INC as all the components are formed within the chip.

How can we reduce the power consumption of IC?

The reduction in power consumption is achieved due to extremely small size of IC. Coils or indicators cannot be fabricated. It can be handle only limited amount of power. High grade P-N-P assembly is not possible. It is difficult to be achieved low temperature coefficient.